MM support Defence applications at multiple levels of our business; with Die components for hybrid solutions, components for board level assembly and sub modules for system integration.Engineering interface team provide local support to designers to enable design support and feedback of industry trends.
Defence
Showing all 119 results
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MN-X-X-X-T01, 30–520MHz, 1W, Tunable Bandpass Filter Series
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AR77A – GPS-Disciplined Rubidium Clock
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MSW2T-2030-192 – Diode Switch
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TGF2978-SM – Transistor
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TGF2977-SM – Transistor
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Nano Atomic Clock
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R521 – Reliant Switch™ – Relay
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TQL9063 – low noise amplifier
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QPC6713 – Digital Step Attenuator
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QPA4363C – 50–4000 MHz Cascadable SiGe Amplifier
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QPA4263C – 50–4000 MHz Cascadable SiGe Amplifier
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QPA2363C – SiGe Gain Blocks
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TX-321 – Ultra Low Phase Noise TCXO
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IP68 – San-tron connector
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VS-507 – Voltage Controlled Saw Oscillator
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GaN X Band 50W SSPA
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QPC6034 – Absorptive High Isolation SP3T Switch
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RM022020 – Amplifier
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VX-505 – Voltage Controlled Crystal Oscillator
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QPD1015L – Transistor
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QPD1015 – Transistor
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QPD1008L – Transistor
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QPD1008 – Transistor
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QPD1003 – Transistor
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QPD1000 – Transistor
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1104-15-020 – Transtector I2R IEP 240 – surge protectors
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1102-014-7 – Transtector (I2R SA230 40) Surge Protector
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ALPU-L130 – Transtector ALPU Lite, surge protector
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ALPU-F140 – Transtector ALPU Fit, surge protector
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ALPU-PTP-M – Transtector surge protectors
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TSJ-6A 1100-592-1 – Transtector surge protector
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TSJ 1101-994 – Transtector surge protector
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DPR 1101-882-1 – Transtector, surge protectors
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TX-550 dual crystal temperature controlled crystal oscillator (TCXO)
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OX-080 Oven controlled crystal oscillator OCXO 10MHz
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OX-305 Oven controlled crystal oscillator OCXO
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OX-070 Oven controlled crystal oscillator
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MD-223 Oven Controlled Coefficient Corrected Oscillator (CCXO)
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VT-820 TCXO Temperature Compensated Crystal Oscillator
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VT-841 TCXO Temperature Compensated Crystal Oscillator
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EX-219 Evacuated Miniature Crystal Oscillator (EMXO)
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VT-800 TCXO Temperature Compensated Crystal Oscillator
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TGF2929-HM – Qorvo GaN Transistor
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QPD1009 – Transistor
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QPD1010 -Qorvo GaN HEMT transistor
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TGL2226-SM – attenuator
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QPA1000 – High-power, S-band amplifier
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QPM1000 – Limiter/LNA combination
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TGA2624-SM – GaN SiC X-Band amplifier
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TGA2622-SM – X-Band GaN SiC amplifier
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TGM2635–CP – MMIC GaN on SiC amplifier
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TGP2108-SM – 6-bit digital phase shifter
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DSC101 – MU Optical Connector Cleaner
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DSC103 – Replacement cartridge for Smart cleaner
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DSC104 – Replacement cartridge for Smart cleaner
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DSC106 – connector cleaner
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DSC107 – connector cleaner
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DSC151 – Transceiver Cleaner stick
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DSP102 – Smart Probe
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DSP104 – Smart Probe
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DSP105 – Smart Probe
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DSP107 – Smart Probe
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DSP108 Smart Probe
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DSC102 – FC Optical Connector Cleaner
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DSC105 – MU, LC Disposable Optical connector cleaner
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DSP103 – Senko Smart probe
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DSP110 – Senko Smart Probe
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DSP111 – Senko Smart Probe
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DSP114 Smart Probe Tip
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DSP115 – Senko Smart Probe
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DTO101 – Senko Smart Meter
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DTO102 – Senko Smart Meter
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DTO104 – Senko Smart Checker
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DTO106 – Senko Smart Source
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SATCOM307 – Ka Band Tx Reject Filter
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DSC108 – Senko Cassette Cleaner
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EW433 – Highpass Filter
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EQ476 – Equaliser
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NANO341 – Waveguide transition
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LW30 – 793208 – Block Upconverter
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G10BU100K5PX10 – 100pF Capacitor
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RFVC4033 – Qorvo VCO
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RF1206X471J501KHTM-HS – 470pF Capacitor
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0603Y1008P20JXT – 8.2pF Capacitor
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TCC00554B – 5.5pF Capacitor
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M3002 – Mixer
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THOR-7500-XA – Synthesiser
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NTC195-6666-360 A6 – Test cable
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FT15KM-0600-S – Flex twist waveguide, Flexiguide
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C100SMNL1938G6 – Inductor
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A0P-41N-3JJ – PIN Diode Attenuator
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2042-12B – Waveguide Bend
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Nano Pole – Tunable Filter
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SFSTC5000220ZC0 – Syfer feedthro
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JN040 – Trimmer capacitor
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Stiletto AL – Aluminium mast
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SLP7130 – Limiter Diode chip
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QTV series – varactor-tunable Gunn oscillators
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QIF series – fullband isolators
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QMB Series – balanced mixers
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QPP–94043018–G0 – W-Band pulsed power amplifier
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MSW2T-8512-740 – Drop-in High Power PIN Diode switch
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RFLM-202602HX-299 – Diode Limiter
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8110RK – Chip Capacitor
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SR1015T01 – Circulator
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RFCR5704 – Circulator RFCI
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P2-20-A – Combiner
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1206-74-VH – Field replaceable connector
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P677 – SMPmale full indent
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RFUV1703 – RF Frequency Converter
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RS-4200CHP – microwave absorbing material
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LWA9026 – Amplifier
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TA100-120-15-10 – Amplifier Gain
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RRP5657K0-41 – Solid State Power Amplifier
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Linwave MMIC Packaging
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IMS1141-10DB – IMS Attenuator
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TGL4201-03 – Qorvo Attenuator
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MRFXF6533 – IMS Transformer
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A75BE12 – waveguide bend
Defence and Military
Microwave and RF components are located across all aspects of Defence Market – Airborne, Naval & Land. Technology advances in higher data rate communications and high volume consumer electronics are more and more adapted to this arena.
Across the world areas of true research are reducing and many systems are now initiated as multi use platforms that can be presented to new customers with minimal investment and risk.
Use of COTS (Commercial off the shelf) products to service a wide part of new system development is usual with small areas of exacting performance left to specialist supply. Most of our manufacturers are involved in different aspects of product realisation.
MM suppliers are active in areas such as:
Radar
Early Warning
Counter IED
Fusing and arming
Data links & telemetry
Radio
The march of GaN for RADAR arrays
New RADAR systems have increasingly utilised active electronically scanned arrays (AESAs) for their radiating and receiving functionality. AESAs offer several advantageous features compared with other radar systems designs, such as jam resistance, frequency agility and graceful degradation.
Design methodology is also pertinent to other applications such as communications.
Legacy systems developed prior to the AESA evolution often require a single or a few high-power transmitters feeding passive or semi-active arrays or antenna structures. These transmitters have often been vacuum electronic devices such as traveling wave tube amplifiers (TWTAs), klystrons, magnetrons, or cross-field amplifiers, as this has historically been the only method to obtain high power RF efficiently
High-power gallium nitride (GaN) monolithic microwave integrated circuit (MMIC) technology in conjunction with broadband, low-loss power combining methods has enabled solid-state alternatives. GaN MMICs can be implemented in an amplifier platform to achieve power levels from hundreds of watts to over 1,000 watts. Several of these high-power modules can then be combined into a transmitter configuration incorporating power supplies, command and control circuitry and thermal management to achieve power levels in the tens of kilowatts. The ability to replace legacy vacuum transmitters with solid-state replacements enhances the reliability of these systems and potentially results in some enhancement of characteristics of the RADAR system.
Vacuum technology requires high voltage power supplies and can suffer from short life – especially in exacting environments. GaN semiconductor MMICs, on the other hand, exhibit mean-time-to-failure of greater than 10 million hours at junction temperatures of 200 °C.
The structure of the high-power modules, because they combine several devices to achieve their composite power output, has an inherent graceful degradation characteristic. The failure of a single device in a single amplifier of this type typically results in less than 0.7 dB loss of power, with approximately 0.7 dB additional reduction for each subsequent device removed from service. In a typical very-high-power application, with several GaN MMIC amplifiers, the transmitter performance acts very similar to an AESA in that a single device failure has a generally inconsequential effect on overall performance and power.
The solid-state transmitter is also found to output generally less thermal noise and fewer spurious signals than a vacuum device. This significantly better performance enables output filtering requirements and associated power handling requirements to be reduced, with associated cost, reliability and performance benefits.
Vacuum Devices typically operate from very high voltage power supplies, generally anywhere from a minimum of several hundred volts to more than 10 kilovolts. This operating range presents significant challenges to the power supply implementation. GaN-based devices operate at much lower voltages, typically between 20 and 48 volts DC. The power supplies operating at these voltages offer significant size, weight, operating life, and cost savings.
Critics of solid-state solutions often point out apparent deficiencies of the technology with respect to its efficiency when compared with a Vacuum Device, correctly claiming that in some applications, VED-based power amplifiers can achieve efficiencies close to 70 percent. High-efficiency GaN devices are now capable of power levels of >100 watts from a single device, which can be combined with a low-loss combiner structure with less than 0.5 dB of loss. Efficiencies of >80% have been claimed for GaN but figures of 50 to 70% are common depending on the amplifier class etc.
While parametric performance for the application is a requirement that either technology must meet to be accepted for use, the opportunity for volume manufacturing capacity and associated cost reduction, along with significant design reuse offers yet another compelling reason to replace legacy VED transmitters. The structure of the GaN devices is inherently broadband, and can be populated with devices that operate across all, some, or just a tiny portion of its frequency coverage. This enables leverage of the myriad of GaN MMIC devices that are commercially available.
While they are not able to replace every application where vacuum devices prevail, solid-state alternatives can be considered where practicable for increasingly high-power microwave signal amplification.