High Rel (High Temp & Space)

MM provide component solutions to designers targeting high temperature solutions for Oil and Gas, space and industrial applications to levels of 200C+.

High Temperature Electronics

Markets such as Energy, Space and Avionics can benefit from components with operational performance outside the existing Defence ranges of -55/+125C. Key markets such as exploration support with down hole monitoring, deep space missions and high altitude avionics all push operational reqts towards  200C.
A number of applications today require electronics to operate in extremely harsh environment conditions. Operation temperature of 150°C and higher are required for energy exploration as well as other emerging applications such as geophysical services, avionics and industrial process control. Environments like these require electronics designed and manufactured specifically to withstand such temperature extremes.
Typically Hybrid Multi-Chip Modules can be utilised for these applications of High Temperature and Harsh Environment Electronics for Deep Space to Deep Earth applications. Additional features such as Wafer Level Packaging, Physical Design Modeling, Finite Element Analysis, RF/signal conditioning and digital embedded system designs enable increased operational reliability.

 

Thick Film circuits

When considering extreme temperature operation alternatives to pcb laminates such as Thick film ccts become useful. Fired at temps over 300 C, the technology has reliability proving in many automotive applications. Component attach is then realiased with conductive epoxy films using packaged or bare die components.   Thick film hybrid technology is a widely-used technology for the manufacture of a ceramic or other type of circuit boards. Due to its high degree of integration, thick film substrates form the basis of High Density Packages (HDP). In an initial manufacturing phase, the structures are applied by means of a silk-screen process onto the relevant substrate material such as aluminium oxide (Al203) or alumina (AIN). Conductors, resistors, insulations and overglazes can be manufactured. Gold, silver and platinum or palladium alloys are generally used as conductive materials. The standard thick film process are printing, drying and firing. The firing process at about 850 °C guarantees the final film properties such as electrical values and adhesive strength.
Thick film technology enables a very simple and flexible manufacture of multilayers with several conductive layers on the front and back side of the substrate. Minimum structure resolutions of 80 – 100 µm can be achieved with this technology. Printed resistors can be trimmed to a output signal of a hybrid circuit. In principle all electronic components can be assembled on a thick film substrate. Therefore solderable as well as bondable surfaces are available
The benefits compare to traditional printed circuit boards are in the thermal and electrical properties of the thick film substrate material. Ceramics are very heat-conductive and as one of the chip base materials, are therefore optimally matched to the TCE of silicon. The above mentioned structure resolutions and the integration of printed, passive components make a circuit miniaturisation possible.
Due to the positive properties of the ceramic base material, thick film circuits are used as a priority in areas which are characterised by harsh environmental conditions (high/low temperatures, temperature changes, moisture, vibrations, accelerations etc.). This technology meets the requirements of the highest integration, reliability, lifetime and environmental compatibility. Areas of application include industrial electronics, medical electronics as well as automotive and aerospace industry.

Capacitors:

Knowles Capacitors manufactures COG chip capacitors designed and tested to operate from -55°C to 200°C. Product applications include harsh environments such as oil exploration and automotive/avionics engine compartment circuitry. Product is available as surface mount chips in sizes 0805 to 7565. Leaded encapsulated devices in sizes 1515 to 7565 for additional high temperature capacitors.Feedthros and shielding solutions are also available for high temp applications

 

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Frequency Control Crystal applications

Vectron offers several High Temperature Crystal Oscillator product platforms for extreme environment applications. Typical operating temperature range is from –55°C to +200°C. In addition, Vectron offers 0°C to 250°C High Temperature Crystal Oscillators for ultra HT applications to meet today’s and future downhole tools requirements.
Feature Sets include :

• BAW & SAW Design & Fabrication to product
high quality Quartz Resonators
• RF Oscillator Circuit Design
• High Temperature Packaging Expertise
• High Temperature Assembly & Test
Expertise
• Environmental Screening

For control oscillators Frequency coverage of 2.20 MHz to 210 MHz, with Standard Operating Temperature Range of –55°C to 200°C (higher temperature ranges available). Crystal blanks can be AT, SC, FC, AC and IT–cut with Swept Quartz–Lot Traceability available.For harsh environments sealing and testing become critical processes -standard leaded cold weld and resistance weld holders are utilised for Commercial and military operating environment with Special shock and vibration capabilities available to produce Low aging, Low phase noise or Low G–Sensitivity (<=2x10–10/g possible) where appropriate. In Oil exploration, Extreme environment applications require electronic systems that are capable of surviving beyond the MIL–STD operating temperature range of –55°C to +125°C. Applications such as Deep Well Logging Tools (sensor, gauge and data acquisition etc.), Geothermal Logging, Light Weight Ground and Air Vehicles and Industrial Process Monitoring require robust electronic systems that can operate at 200°C and beyond. In addition, some of these applications also require survivability under high shock and vibration environments. Vectron's expertise readily handles such harsh environments. For example, our custom engineered High-temperature electronic modules have been qualified and deployed for 250°C+ "down hole" drilling/exploration applications.In order to withstand the harsh operating environment, high temperature electronic products are designed from the ground–up with the knowledge of advanced assembly processes as well as material science. Using robust assembly techniques, Vectron offers the flexibility of applying a wide range of manufacturing processes to meet the customer's unique application requirements and ensure the delivery of the highest quality product. Each run is intensely scrutinized during the process control and process automation phases of delivery. Market leading manufacturing using a wide breadth of technologies is utilised across the product range, clean rooms for BAW/SAW Quartz Wafer Fabrication, Deep Wet Etching of Quartz Wafers. Thick–Film Substrate Fabrication with Al2O3, BeO, AlN, Multi–Layer materials. Hybrid Component Attachment using Flip Chip, Eutectic die mount, fine–pitch SMT. Wirebonding interconnect with Al and Au wirebonding. Metal package are the preferred package choice for high heat dissipation, high component count & density such as Multi–chip–module(MCM) and critical EMI shielding applications. Metal package can be designed to fit custom application at low volume with reasonable tooling cost. Ceramic Package, on the other hand, provides a small footprint and fine I/O pitch package solution. Ceramic package can be designed for ultra high temperature applications starting at 500°C. Tooling cost is typically much higher than metal package. Ceramic package is suitable for medium to high volume applications. It is absolutely the choice of the end users to select the right kind of package for their particular applications. Both metal and ceramic packages can be sealed hermetically. Microelectronic circuits and components that are exposed to harsh environments require hermetic packaging. Beyond providing mechanical protection and thermal dissipation, a hermetic package prevents the intrusion of atmospheric contaminants such as moisture, ionic contaminants, airborne particles and unwanted gases. http://www.vectron.com/products/hitemp/hitemp_tech_Cap.htm Metal Package – Glass–to–metal seal and ceramic–to–metal seal are the common choices for metal hermetic packages. Typical metal encloses are formed by stamping, deep drawing, brazing, photochemical etch and machining. The package sealing methods include projection weld, seam seal, cold weld, laser weld and E–beam seal. Metal Package choices range from standard DIL, TO, FP, QFP to highly custom–design package for High–Temp, High–Pressure and High Shock and Vibration environment for HI–REL, Mil/Space and "Down Hole" applications. Ceramic Package – In High Temperature Co–fired Ceramic (HTCC) technology, ceramic is batch processed in green tape form. Layers are built by sequential operations of hole punching, metal filling and screening, cutting, stacking and laminating. The entire assembly is co–fired or sintered at temperatures as high as 1600°C. Electrode–Nickel/Gold plating finish with a brazed–on KOVAR ring is Vectrons preferred configuration. Vectron is capable of assembling Microcircuits with standard LCC, CQFP, Side–Brazed type and custom–design ceramic packages. http://www.vectron.com/products/hitemp/hitemp_index.htm

Component and circuit design

When considering extreme temperature operation alternatives to pcb laminates such as Thick film ccts become useful. Fired at temps over 300 C, the technology has reliability proving in many automotive applications. Component attach is then realiased with conductive epoxy films using packaged or bare die components. Thick film hybrid technology is a widely-used technology for the manufacture of a ceramic or other type of circuit boards. Due to its high degree of integration, thick film substrates form the basis of High Density Packages (HDP). In an initial manufacturing phase, the structures are applied by means of a silk-screen process onto the relevant substrate material such as aluminium oxide (Al203) or alumina (AIN). Conductors, resistors, insulations and overglazes can be manufactured. Gold, silver and platinum or palladium alloys are generally used as conductive materials. The standard thick film process are printing, drying and firing. The firing process at about 850 °C guarantees the final film properties such as electrical values and adhesive strength.

Thick film technology enables a very simple and flexible manufacture of multilayers with several conductive layers on the front and back side of the substrate. Minimum structure resolutions of 80 – 100 µm can be achieved with this technology. Printed resistors can be trimmed to a output signal of a hybrid circuit. In principle all electronic components can be assembled on a thick film substrate. Therefore solderable as well as bondable surfaces are available.

The benefits compare to traditional printed circuit boards are in the thermal and electrical properties of the thick film substrate material. Ceramics are very heat-conductive and as one of the chip base materials, are therefore optimally matched to the TCE of silicon. The above mentioned structure resolutions and the integration of printed, passive components make a circuit miniaturisation possible.

Due to the positive properties of the ceramic base material, thick film circuits are used as a priority in areas which are characterised by harsh environmental conditions (high/low temperatures, temperature changes, moisture, vibrations, accelerations etc.). This technology meets the requirements of the highest integration, reliability, lifetime and environmental compatibility. Areas of application include industrial electronics, medical electronics as well as automotive and aerospace industry.

Thermal management and Interconnect

Working at high temperature also leads to magnified thermal heating issues, IMS produce a range of Thermal Management Devices Therma-Bridge™ & Therma-Plane™ The concept behind the Therma-Bridge™ and Therma-Plane™ is simple yet revolutionary. Rather than address thermal issues using fans with complex circuitry, use an electrically isolated, thermally conductive ceramic chip to move heat efficiently from a problem on a board to an area that can safely dissipate heat. The Therma-Bridge™ is currently being used in numerous applications where a fan or other thermal management techniques are either space prohibitive or active cooling causes a threat to device reliability (in the case of fan failure).

Applications Using Therma-Bridge™ include RF Amplifiers, Conduction Cooled Computers, Power Supplies & Converters, JTRS, MIDS-J, GMR, AMF, Temperature Controlled Oscillators, Lighting Ballasts, Protecting Neighboring Components,Conduction Cooled Handhelds,P25 Radios & Basestations,Electrically Isolated Thermal Coupling

http://ims-resistors.com/Thermal_Management.html

The Aluminum Nitride (AlN) Therma-Plane is a simple, cost effective device whichaids in thermal management. Therma-Planes are available in standard sizes and thicknesses. Custom sizes are also available on request. The Therma-Plane is an electrically isolated device designed to transport heat from one location to another. Simply attach one side to the heat source, and the other side to a thermal plane or heat sink. A popular application configuration is shown below. The Therma-Plane has the following features Very high thermal dissipation, Protection of crucial board components from heat, Optimal control over board temperature.

Interconnect

EMI Filtering becomes an issue for harsh environments with noise induction on to long data runs. Gowanda have a line of high temperature products for filtering applications. Gowanda HT series torroids are available in current ratings to 2.2A with electromagnetic shielding; to 1000micro H.

www.gowanda.com

At temperature extremes interconnections become high risk areas with the need for management of coaxial and dc interconnects www.carlisleit.com Carlisle divisions of Thermax and Radex both offer high temp cable solutions to over 400C.

The use of more engineered insulation and jacket technologies, such as Polyimide, EFGLAS, PEEK, PTFE, ETFE allow solutions to be enabled with chemical resistance and operating temperatures to over 260C.

Carlilse site in Littlebrough UK have a full engineered capability for bespoke solutions to be tailored for many applications such as Oil/Gas, seismic sensing, geo physical , thermocouples, Airborne, cathodic protection. Extensive compliance to standards such as UL is quite unique within UK cable manufacturing.

www.carlisleit.com