Chip Assembly Solutions


Linwave support MMIC and semiconductor Die level packaging within a class 10K clean room facility, supported with a broad level of RF/Microwave design capability. Product showcase includes Limiters, Detectors, LNAs, MMICs, Gunn Diodes in ceramic and laminate packages.

Electronic Packaging Services

Microwave Marketing works in conjunction with Linwave Technology who have recently comissioned a new Hi-Tech manufacturing division for manufacturing diodes and packaging die components and MMICs.
The Linwave Electronic Manufacturing Services facility boasts a 2000 sq ft class 10,000 cleanroom, local area class 100 laminar flow facilities, automated Optical Inspection facilities, a wide range of die mount and bond equipment and RF test and measurement equipment up to 94GHz capability.
Linwave have the flexibility for small scale batch runs and prototyping, and the capability for large scale mass production on site.
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